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VERMES Microdispensing launches its next generation Hot Melt System Solution offeringhighest process accuracy and application flexibility

The next generation Hot Melt System Solution from VERMES Microdispensing offers multiple options for most
complex dispensing patterns with precise droplet break-off that ensure ultra-thin lines and beads at highest
dispensing speeds. The advanced solution achieves extremely rapid dispense cycles with uniformly distributed
adhesives resulting in improved end product yields.
“A large hot melt dispensing market is the electronics sector ever-smaller electronic devices, gadgets,
smartphone components and high precision molded components. Typical applications require line widths
between 200-500 μm and high levels of accuracy and consistency,” states Juergen Staedtler, CEO of VERMES
VERMES Microdispensing’s Hot Melt Solution offers superior process control and accuracy that is required in
high-tech automated production operations.
The Hot Melt Solution which is based on the high-speed jet valve MDV 3250+ is designed for a broad range of
hot melt types, including the widely used PURs (Polyurethane hot melt. It complements the unique heating
concept by VERMES Microdispensing that offers customized heating solutions for high and highest viscous
The heating solutions are designed to perfectly coordinate with the dispensing process accomplishing
significantly improved precision, drop reproducibility and performance.
The integrated cartridge heater of the new Hot Melt System Solution continuously heats the hot melt to its
melting point ensuring highest process stability. During the entire process the temperature is precisely monitored
by the MFC universal, a multifunctional heating controller of VERMES Microdispensing.
The modular and flexible design of the VERMES Microdispensing solutions allows for the systems to be easily
and individually configured. The user can choose from a range of equipment for different flow rates and

Further reading

Exhibitor: VERMES Microdispensing


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