The next generation Hot Melt System Solution from VERMES Microdispensing offers multiple options for most complex dispensing patterns with precise droplet break-off that ensure ultra-thin lines and beads at highest dispensing speeds. The advanced solution achieves extremely rapid dispense cycles with uniformly distributed adhesives resulting in improved end product yields.
“A large hot melt dispensing market is the electronics sector ever-smaller electronic devices, gadgets, smartphone components and high precision molded components. Typical applications require line widths between 200-500 μm and high levels of accuracy and consistency,” states Juergen Staedtler, CEO of VERMES
VERMES Microdispensing’s Hot Melt Solution offers superior process control and accuracy that is required in high-tech automated production operations.
The Hot Melt Solution which is based on the high-speed jet valve MDV 3250+ is designed for a broad range of hot melt types, including the widely used PURs (Polyurethane hot melt). It complements the unique heating concept by VERMES Microdispensing that offers customized heating solutions for high and highest viscous applications.
The heating solutions are designed to perfectly coordinate with the dispensing process accomplishing significantly improved precision, drop reproducibility and performance. The integrated cartridge heater of the new Hot Melt System Solution continuously heats the hot melt to its melting point ensuring highest process stability. During the entire process the temperature is precisely monitored
by the MFC universal, a multifunctional heating controller of VERMES Microdispensing.
The modular and flexible design of the VERMES Microdispensing solutions allows for the systems to be easily and individually configured. The user can choose from a range of equipment for different flow rates and viscosities.
Exhibitor: VERMES Microdispensing GmbH